| 型号/型号规格 | 分类 | 品牌 | 封装 | 批号 | 数量 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| TPS51124RGET | 稳压IC |
TI/德州仪器 |
QFN24 |
09+ |
110 |
|||
| ATMEGA644PA-MU | IC |
MICROCHIP/微芯 |
VFQFN-44 |
2308+ |
720 |
|||
| HI3531DRBCV100 | IC |
HISILICON/海思 |
BGA |
20+ |
47 |
|||
| TPS54310PWP | IC |
TI/德州仪器 |
HTSSOP20 |
09+ |
88 |
|||
| MIC7401YFL-T5 | 稳压IC |
MICROCHIP/微芯 |
QFN-36-EP |
202507 |
5 |
|||
| HT48R30A-1 | IC |
HOLTEK/合泰 |
DIP-24 |
300 |
||||
| SIM7600G-H R2 | 通讯模块 |
SIMCOM/芯讯通 |
23+ |
28 |
||||
| PR5W5036-2P-C-H | 圆形连接器 |
SAMZO/三佐 |
DIP2.54-2P |
202507 |
200 |
|||
| PIC16F630-I/SL | MICROCHIP/微芯 |
SOP14 |
489 |
|||||
| 14305R-2000 | IC |
RENESAS/瑞萨 |
QFN |
2245+ |
5 |
|||
| STM32F334C8T6 | IC |
ST/意法 |
23+ |
5600 |
||||
| MAX3232ESE+T | IC |
ADI/亚德诺 |
23+ |
6600 |
||||
| DS18B20+ | IC |
ADI/亚德诺 |
23+ |
3800 |
||||
| MIMXRT1052CVL5B | IC |
NXP/恩智浦 |
23+ |
3500 |
||||
| MT29F32G08ABAAAWP-ITZ:A1 | IC |
MICRON/美光 |
23+ |
5200 |
||||
| W25N01GVZEIG | IC |
WINBOND/华邦 |
23+ |
5900 |
||||
| W25N01KVZEIR | IC |
WINBOND/华邦 |
23+ |
4600 |
||||
| UA7805CKCS | 稳压IC |
TI/德州仪器 |
TO-220 |
10+ |
5 |
|||
| TS3A24159DGSR | 模拟IC |
TI/德州仪器 |
MSOP10 |
09+ |
25 |
|||
| TPA2005D1DRBR | 音频IC |
TI/德州仪器 |
QFN8 |
09+ |
10 |
商家默认展示20条库存